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Silver metallization : stab...
"Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology." "Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization."--Jacket
Monografía
monografia Rebiun25803895 https://catalogo.rebiun.org/rebiun/record/Rebiun25803895 m o d cr cn||||||||| 080226s2008 enka ob 001 0 eng d 261067108 288182585 326882711 607257229 613472265 648346876 739154184 756429511 880321648 985038286 994722971 1005830174 1035663666 1044302772 1056350335 1058109902 1060864980 1066631400 1071883030 1075393442 1078868599 1087274215 1097317048 1097339667 1105598542 1110938397 1112590670 9781848000278 1848000278 9781848000261 hardcover ; alk. paper) 184800026X hardcover ; alk. paper) 6611117865 9786611117863 10.1007/978-1-84800-027-8 doi AU@ 000048655212 DEBSZ 276334132 DEBSZ 430479301 NZ1 12059499 978-1-84800-026-1 Springer http://www.springerlink.com GW5XE eng pn GW5XE OCLCG CEF YNG NUI DKU N$T OCLCQ TPH MNU E7B UBC IDEBK EBLCP OCLCQ A7U OCLCQ OCLCO OCLCF BEDGE OCLCQ SLY YDXCP DEBSZ OCLCQ LVT VT2 OTZ OCLCQ UAB ESU NJR STF OCLCQ U3W AU@ OCLCQ WYU ICG UWO YOU OCLCO CANPU OCLCA CNTRU UKAHL OCLCQ OCLCO AUD ZHM ERF OCLCQ OCLCA TEC 008020 bisacsh TEC 008010 bisacsh PHFC bicssc 669.23 22 TN40 clc Adams, Daniel Silver metallization stability and reliability Daniel Adams, Terry L. Alford and James W. Mayer London Springer 2008 London London Springer 1 online resource (xi, 123 pages) illustrations 1 online resource (xi, 123 pages) Text txt rdacontent computer c rdamedia online resource cr rdacarrier text file PDF rda Engineering materials and processes Includes bibliographical references and index Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary "Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology." "Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization."--Jacket English Silver- Electrometallurgy Electrochemical metallizing Integrated circuits- Materials Silver silver TECHNOLOGY & ENGINEERING- Electronics- Circuits- Integrated. TECHNOLOGY & ENGINEERING- Electronics- Circuits- General. Electrochemical metallizing. Integrated circuits- Materials. Silver- Electrometallurgy. Chimie. Science des matériaux. Electrochemical metallizing. Integrated circuits- Materials. Silver- Electrometallurgy. Electronic books Alford, Terry L. Mayer, James W. 1930-) Springer e-books Springer e-books Print version Adams, Daniel. Silver metallization. London : Springer, 2008 9781848000261 184800026X (OCoLC)156891512 Engineering materials and processes