Descripción del título
Substrate Noise Coupling in...
Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs . This is particularly critical when process feature sizes scale down to the nano meter range. Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC
Monografía
monografia Rebiun13779585 https://catalogo.rebiun.org/rebiun/record/Rebiun13779585 cr nn 008mamaa 100301s2008 ne | s |||| 0|eng d 9781402081668 978-1-4020-8166-8 10.1007/978-1-4020-8166-8 doi UMO 71634 UPVA 996891496403706 UAM 991007781700504211 UCAR 991007934197404213 UPCT u358700 TJFC bicssc TEC008010 bisacsh 621.3815 23 Helmy, Ahmed Substrate Noise Coupling in RFICs Recurso electrónico-En línea] by Ahmed Helmy, Mohammed Ismail Dordrecht Springer Netherlands 2008 Dordrecht Dordrecht Springer Netherlands digital Analog Circuits And Signal Processing Series Engineering (Springer-11647) Accesible sólo para usuarios de la UPV Recurso a texto completo Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs . This is particularly critical when process feature sizes scale down to the nano meter range. Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC Reproducción electrónica Forma de acceso: Web Engineering Telecommunication Systems engineering Engineering Circuits and Systems Communications Engineering, Networks Ismail, Mohammed SpringerLink (Servicio en línea) Springer eBooks Springer eBooks Printed edition 9781402081651 Analog Circuits And Signal Processing Series